'Ball Grid Array'

Low Cost Flip Chip Technologies

One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing, 'ball grid array' and reliability issues related to low cost flip chip technologies. This eye-opening overview tells you what you need to know about applying flip chip technologies to direct chip attach(DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), 'ball grid array' and plastic ball grid array (PBGA) package assemblies. You'll discover flip chip problem-solving methods, 'ball grid array' and learn how to choose a cost-effective design 'ball grid array' and reliable, high-yield manufacturing process for your interconnect systems as you explore...*IC trends 'ball grid array' and packaging technology updates*Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys*Sequential build up PCB with microvias 'ball grid array' and via-in-pad*How to select underfill materials*And much, much more! Copyright (C) Muze Inc. 2005. For personal use only. All rights reserved.
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Ball grid array - A ball grid array is a type of surface-mount packaging used for integrated circuits. It is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern.

Land grid array - The land grid array (LGA) is a physical interface for microprocessors of the Intel Pentium 4 family. Unlike the pin grid array (PGA) interface found on most AMD and Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch pins on the motherboard.

Pin grid array - The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors. The integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a square array of metal pins.

Flip-chip pin grid array - Flip Chip Pin Grid Array (FC-PGA or FCPGA) is the package of certain Intel Celeron, Pentium III, and Pentium 4 microprocessors. FC-PGA processors fit into Socket 370 or Socket 478 motherboard sockets.

ballgridarray

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Plastic Clamshell Packaging - ... Processing, Applications, And Regulations The first comprehensive and in-depth guide to low cost flip chip technology is taking the electronics industry by storm. For professionals active in flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. With this book you will develop a practical understanding of the economic, design, materials, process, equipment, quality, manufacturing, and reliability of issues of low cost flip chip technology is taking the electronics industry by storm. ...

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The new socket has had numerous problems with heat dissipation, and bent pins in motherboards. This one-stop guide meets the reference needs of engineers in the fields of design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection. Among the topics explored: IC trends and packaging technology updates; more than 100 lead-free solder alloys; sequential build up PCB with microvias and via-in-pad; FCOB with anisotropic conductive adhesive (ACA); solder-bumped FCOB with conventional underfills; how to select underfill materials; thermal management of solder-bumped FCOB; failure analysis ofsolder-bumped FCOB; design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection. Among the topics explored: IC trends and packaging technology updates; more than 12 different wafer-bumping methods; more than 12 different wafer-bumping methods; more than 100 lead-free solder alloys; sequential build up PCB with microvias and via-in-pad; FCOB with anisotropic conductive adhesive (ACA); solder-bumped FCOB with conventional underfills; how to select underfill materials; thermal management of solder-bumped FCOB; failure analysis ofsolder-bumped FCOB; design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection. Among the topics explored: IC trends and packaging technology 'ball grid array'.