Array Ball Grid Technology
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Ball grid array - A ball grid array is a type of surface-mount packaging used for integrated circuits. It is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern.
FBGA - FBGA or Fine Ball Grid Array is a die-packaging technology for integrated circuits
Land grid array - The land grid array (LGA) is a physical interface for microprocessors of the Intel Pentium 4 family. Unlike the pin grid array (PGA) interface found on most AMD and Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch pins on the motherboard.
Pin grid array - The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors. The integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a square array of metal pins.
arrayballgridtechnology
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